35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing

Product Details
Customization: Available
Industrial Use: Food, Pharmaceutical, Apparel, Agriculture
Layered: Functional Layer
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  • 35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing
  • 35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing
  • 35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing
  • 35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing
  • 35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing
  • 35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing
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  • Overview
  • Product Parameters
  • Detailed Photos
  • Company Profile
  • Certifications
  • Our Advantages
  • Facilities and equipment
  • Our Strategic Partners
  • Packaging & Shipping
Overview

Basic Info.

Hardness
Soft
Bag Sealing Methods
Cylindrical Bag
Grammage
35g
Density
0.7G/M^3
Moisture
4~7%
pH Value
5~7.5
Whiteness
80%
Permeability Bottom Resistance
4~8μm/PA.S
Smoothness
0~40s
Rigidity(MD)
>0.09mn.M
Rigidity(Td)
>0.05mn.M
Tensile Strength(MD)
>5.5kn/M
Tensile Strength(Td)
>3.0kn/M
Ash Specification
<1.0%
Transport Package
Carton/Pallet
Specification
Customizible
Origin
China

Product Description

Product Parameters
Main items / Subitems Specifications / Values
Grammage 35g
Appearance / Color Roll/white
Single roll finish product
available dimensional value
Available Thickness(mm) 0.05±0.01
Roll Width(mm)[customizable] customized
Roll Length(M)[customizable] customized
Main
Characteristics
Items Unit Typical Value Test condition or method
Density g/m^3 0.7 Analytical balance
Moisture % 4~7 Analytical balance
PH value / 5~7.5 PH value tester
Whiteness % 80 Colorimeter
Permeability bottom resistance μm/pa.S 4~8 Densometer
Smoothness S 0~40 Smoothness meter
Rigidity MD mn.m >0.09 Rigidity meter
TD mn.m >0.05
Tensile strength MD kn/m >5.5 Tension meter
TD kn/m >3.0
Ash specification % <1.0 Analytical balance
Detailed Photos
35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing

 

Company Profile

    Keraf group was founded in 2014 under the exclusive and strategic mandate of GrafTech®, a world-renowned graphite brand with a history of more than 130 years, to expand the Chinese market. Our company is located in the complete industrial chain, full competition, with the world factory reputation of Dongguan City, China.
    Keraf tech is a well-established and professionally managed corporation with nearly 10 years of distinguished record in research and development, production, and marketing of various interface materials and components in China domestic and overseas markets.
    After nearly ten years of technology accumulation and intensive development, Keraf group has been transformed from a factory focused on OEM thermal management materials die-cutting production into a comprehensive industrial group with one-stop services such as ODM thermal tech design, hardware and plastic processing, LSR components, industrial coating materials and so on.
    Keraf group's core products have covered 3C electronics, semiconductor, equipment, automotive, new energy, photovoltaic power generation, shipping, aviation and other industries to provide a full range of high performance, excellent quality interface material solutions.
    Always adhering to the integrity, focus, innovation, win-win business philosophies, Keraf Group have already established and maintained a good cooperative relationship with many global clients. We are also looking forward to becoming one of your reliable and trusted long-term strategic partners.

35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing
Certifications

 

35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing
Our Advantages

 

35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing
Facilities and equipment

 

35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing
Our Strategic Partners

 

35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing
Packaging & Shipping

 

35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing
35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing
35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing
 
35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing
35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing
35g White Sulfur Free Paper for Silver Products Containing Silver Surface Plating Process and Padding Packaging Spacing
 

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