• High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food
  • High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food
  • High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food
  • High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food
  • High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food
  • High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food

High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food

Industrial Use: Food, Pharmaceutical, Electronic Components
Transparency: Transparent
Layered: Heat Seal
Hardness: Soft
Basic Level: Co-Extruded Film
Functional Layer: EVOH
Samples:
US$ 1/Square Meter 1 Square Meter(Min.Order)
| Request Sample
Customization:
Manufacturer/Factory

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  • Overview
  • Product Parameters
  • Detailed Photos
  • Company Profile
  • Certifications
  • Our Advantages
  • Installation Instructions
  • Our Strategic Partners
  • Packaging & Shipping
Overview

Basic Info.

Packaging
Bag
Customization
Available
Transport Package
Carto/Pallet
Specification
customizable
Origin
China

Product Description

Product Parameters
0 Specifications / Values
Structure Multi-layer coextrusion
Appearance / Color Roll/Transparent
Single roll finish product
available dimensional value
Typical Roll Thickness(μm) 120±6
Typical Roll Width(mm) [Customizable] 2700
Typical Roll Length(M) [Customizable] 1500
Main
Characteristics
Items Unit Test method Typical Value
Tensile Strength  Mpa GB/T 13022-1991 >30
Elongation at break % GB/T 13022-1991 >350%
 Coefficient Of Friction(IN/IN) N/A GB/T 10006-1998  <0.45
Oxygen transmission rate
( at 23ºC,0%R.H)
cc/sq.m/day  ASTM D3985-1995 <3
 Water vapor transmission rate
(at 38ºC,90%R.H)
g/sq.m/day ASTM F1249-2001 <4
Sealing Strength N/15mm QB/T2358-1998 >25
Sealing temperature ºC N/A 160~180
Sealing time  S N/A 1.5
Sealing pressure  KPa N/A 300
Haze % GB/T 2410-1980 <14
Storage Condition Stored in original cartons at 70°F (21°C) and 50% relative humidity,avoid direct sunlight.
Period Of Validity It is best to use it within 12 months from date of delivery
Product Main Features:
1>With high barrier and puncture resistance, it can extend the shelf life of the articles and maintain the fragrance of the articles for a long time.
2>The special multi-layer structure arrangement of the product provides good mechanical properties and processing adaptability for the film.
3>The good film transparency of the product provides a transparent visual packaging effect for packaging items.
4>The product has good heat sealing performance, and the heat sealing temperature reaches 180 degrees Celsius
Detailed Photos
High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food
High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food
High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food

 

High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food
High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food
High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food
Company Profile
 

    Keraf group was founded in 2014 under the exclusive and strategic mandate of GrafTech®, a world-renowned graphite brand with a history of more than 130 years, to expand the Chinese market. Our company is located in the complete industrial chain, full competition, with the world factory reputation of Dongguan City, China.
    Keraf tech is a well-established and professionally managed corporation with nearly 10 years of distinguished record in research and development, production, and marketing of various interface materials and components in China domestic and overseas markets.
    After nearly ten years of technology accumulation and intensive development, Keraf group has been transformed from a factory focused on OEM thermal management materials die-cutting production into a comprehensive industrial group with one-stop services such as ODM thermal tech design, hardware and plastic processing, LSR components, industrial coating materials and so on.
    Keraf group's core products have covered 3C electronics, semiconductor, equipment, automotive, new energy, photovoltaic power generation, shipping, aviation and other industries to provide a full range of high performance, excellent quality interface material solutions.
    Always adhering to the integrity, focus, innovation, win-win business philosophies, Keraf Group have already established and maintained a good cooperative relationship with many global clients. We are also looking forward to becoming one of your reliable and trusted long-term strategic partners.

High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food

Certifications
High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components FoodHigh Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food
Our Advantages

 

High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food
Installation Instructions

 

High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food
Our Strategic Partners

High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food

Packaging & Shipping

 

High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food
High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food
High Barrier Property High Temperature Resistance120um Vacuum Heat Seal PP Film with EVOH Layer Structure for Packaging of Electronic Components Food




 

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