Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
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Product Attributes
- Customization
- Available
- Certification
- GS, RoHS, CE, ISO9001
- Color
- Transparent
- Model NO.
- MG-6410B-AU
- Heat Resistance
- Normal Temperature
- Waterproof
- Waterproof
- Application
- Wafer Dicing
- Adhesive
- Acrylic
- Base Material
- Po Film
- Type
- Wafer UV Dicing Tape
- Product Name
- UV Release Dicing Tape
- Liner
- Pet Release Liner
- Feature
- Easy Peeling No Residue
- Adhesion Before UV
- 280~380 G/in
- Adhesion After UV Irradiation
- < 10 G/in
- Transport Package
- Carton
- Specification
- customizable
- Trademark
- Migui
- Origin
- Dongguan
Shipping
- Shipping Cost:
- Contact the supplier about freight and estimated delivery time.
Online Trading Protection
- Payment Guarantee
-
Platform-protected payments with refund support for eligible order issues.
- Platform Logistics
- Clearer shipment tracking with platform-supported logistics.
- Inspection Service
- Optional pre-shipment inspection for quality and quantity checks.
- After-Sales & Dispute Handling
- Platform-assisted dispute resolution, including refunds or returns when applicable.
Only orders placed and paid through Made-in-China.com Secured Trading are eligible for payment protection and the corresponding platform services.
Product Images of Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
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Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing -
Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing -
Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing -
Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing -
Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing -
Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing -
Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
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Product Description
| Main items / Subitems | Specifications / Values | |||||
| Carrier type or Base Backing | 80 μm polyolefin carrier | |||||
| Type of release film | With clear PET self-liner | |||||
| Appearance / Color | Roll / Matte translucent | |||||
| Single roll finished product available dimensional value |
Total available thickness(μm) | 90 ± 5 | ||||
| Roll Width(mm) [customizable] | 400 | |||||
| Roll Length(M) [customizable] | 100 | |||||
| Main Characteristics |
Items | Unit | Typical value | Test method | ||
| Adhesion before UV irradiation | g/in | 280~380 | JIS Z0237 | |||
| Adhesion after UV irradiation | g/in | < 10 | JIS Z0237 | |||
| UV radiation | mJ/cm2 | 300 | UV energy meter | |||
| Tensile Strength(MD) | N/cm | 23 | JIS K6768 | |||
| Tensile Strength(TD) | N/cm | 19 | JIS K6768 | |||
| Elongation(MD) | % | 660 | JIS K6732 | |||
| Elongation(TD) | % | 690 | JIS K6732 | |||
| Storage Condition | stored in original cartons at 70°F (21°C) and 50% relative humidity | |||||
| Period Of Validity | 6 months from date of manufacture, avoid exposing to direct sunlight | |||||
Keraf group was founded in 2014 under the exclusive and strategic mandate of GrafTech®, a world-renowned graphite brand with a history of more than 130 years, to expand the Chinese market. Our company is located in the complete industrial chain, full competition, with the world factory reputation of Dongguan City, China.
Keraf tech is a well-established and professionally managed corporation with nearly 10 years of distinguished record in research and development, production, and marketing of various interface materials and components in China domestic and overseas markets.
After nearly ten years of technology accumulation and intensive development, Keraf group has been transformed from a factory focused on OEM thermal management materials die-cutting production into a comprehensive industrial group with one-stop services such as ODM thermal tech design, hardware and plastic processing, LSR components, industrial coating materials and so on.
Keraf group's core products have covered 3C electronics, semiconductor, equipment, automotive, new energy, photovoltaic power generation, shipping, aviation and other industries to provide a full range of high performance, excellent quality interface material solutions.
Always adhering to the integrity, focus, innovation, win-win business philosophies, Keraf Group have already established and maintained a good cooperative relationship with many global clients. We are also looking forward to becoming one of your reliable and trusted long-term strategic partners.
About the Supplier
This supplier has been audited by TÜV Rheinland. Verify the report on the official TÜV Rheinland website with ID "MIC-ASR252850". Items marked "
" are certified.
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Company Profile
Keraf group was founded in 2014 under the exclusive and strategic mandate of GrafTech® , a worldrenowned graphite brand with a history of more than 130 years, to expand the Chinese market. Our company is located in the complete industrial chain, full competition, with the world factory reputation of Dongguan City, China.
Keraf tech is a well-established and professionally managed corporation with nearly 10 years of distinguished record in research and development, production, and marketing of various interface materials and components in China domestic and overseas markets. Our company won the national high-tech Enterprise certificate in 2019.
After nearly ten years of technology accumulation and intensive development, Keraf group has been transformed from a factory focused on OEM thermal management materials die-cutting production into a comprehensive industrial group with one-stop services such as ODM thermal tech design, hardware and plastic processing, LSR components, industrial coating materials and so on.
Keraf group's core products have covered 3C electronics, semiconductor, equipment, automotive, new energy, photovoltaic power generation, shipping, aviation and other industries to provide a full range of high performance, excellent quality interface material solutions.
Always adhering to the integrity, focus, innovation, win-win business philosophies, Keraf Group have already established and maintained a good cooperative relationship with many global clients. We are also looking forward to becoming one of your reliable and trusted long-term strategic partners.
About Our Factory & Business Background
-
Business Type
- Manufacturer/Factory & Trading Company
- Address
- Dongguan, Guangdong, China
-
Terms of Payment
- T/T
-
International Commercial Terms(Incoterms)
- FOB
-
Average Lead Time
-
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays -
Nearest Port
- Shenzhen Port
-
Minimum Order Quantity
- 1000 pcs
-
Supply Chain Partners
- 73
Our Production Capability & Technical Expertise
- Main Products
- Graphite Sheet and Die Cutting Parts Thereof, Die-Cut Components for The Electronics Industry, Auxiliary Materials for The Semiconductor Field, Industrial Materials for Coating or Components, Hardware Plastic Design and Manufacturing, LSR Processing and Assembly Parts Thereof
-
Production Lines
- 3
-
Production Machines
- Liquid silicone rubber molding machine, Horizontal injection press, Vertical injection molding machine, CCD, VMS, Constant temperature and humidity test chamber, Rubber alcohol abrasion testing machine, RCA Paper tape abrasion testing machine, Digital display constant temperature water bath pot, Air tightness tester, Tensiometer
-
QA/QC inspectors
- 1 people
-
Inspection Type for Finished Products
- Random inspection(Visual inspection & Function inspection)
-
Inspection Method for Finished Products
- Have instructions and uniformly followed
-
Customization Options
- Customization from Samples, Customization from Designs, Full Customization, Minor Customization, Flexible customization
-
ODM Service Available
- Yes
-
OEM Service Available
- Yes
-
R&D Engineers
- 4 people
-
Traceability of Raw Materials
- No
Our Industry Experience & Global Business Record
-
Year of Establishment
- 2014-10-20
-
Export Year
- 11 Years
-
Main Markets
- Southeast Asia/ Mideast, Domestic
-
Number of Foreign Trading Staff
- 5
-
Overseas Agent/Branch
- No
-
New Products Launched in Last year
- No
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- Graphite sheet and die cutting parts thereof
- LSR processing and assembly parts thereof
- Industrial materials for coating or components
- Auxiliary materials for the semiconductor field
- Die-cut components for the electronics industry
- Others
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- MG-6410B-AU
- Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
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