High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply

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  • 4 yrs

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Product Highlights

  • Waterproof and Anti-Aging: Features superior waterproof, moisture-proof, and anti-aging properties during curing.
  • Flexible Customization: Supports full customization including composition, ratio, and thermal conductivity specs.
  • Low Viscosity Application: Viscosity of 3500-4500 CPS allows easy operation and filling for integrated chips.
  • No Shrinkage Curing: The adhesive does not shrink during the curing process, ensuring stable bonding.
  • Flame Retardant: Provides good electrical insulation and flame retardancy for enhanced safety.

Product Images of High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply

High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply pictures & photos
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply pictures & photos
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply pictures & photos
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply pictures & photos
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply pictures & photos
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply pictures & photos
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
  • High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
    High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
  • High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
    High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
  • High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
    High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
  • High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
    High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
  • High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
    High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
  • High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
    High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply

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Product Description

Product Parameters
Main items / Subitems Specifications / Values
Product composition Component A glue:Component B glue
Appearance / Color Component A glue Component B glue
Liquid/Gray Liquid/White
Mixture ratio, by weight A:B=1:1
Cured color Gray
Main
Characteristics
Items Unit Test method Typical Value
Hardness Shore A ASTM D2240 55 ~ 65
viscosity CPS ASTM D412 3500~4500
Operation time (25ºC) Min N/A 30~60 min
Volume resistivity Ω • cm ASTM D419 >=1.0*1016
Curing speed(25ºC) Hour N/A 4~8H
Density g/cm3 ASTM D792 1.5~1.6
Dielectric strength kV / mm ASTM D3755 >=20
Dielectric constant 1.2MHz ASTM D150 2.8~3.3
Dilatation coefficient m/ (m·K) ASTM D696 <=2.1*104
Thermal Conductivity W/m·K ASTM D5470 1
Storage Condition Stored in original cartons at 70°F (21°C) and 50% relative humidity
Period Of Validity It is best to use it within 12 months from date of delivery
Product Main Features:
1> Two-component silicone additive potting adhesive, universal, low viscosity, easy to operate.
2> The adhesive material is stored for a long time after mixing at room temperature, but it can be quickly cured under heating conditions.
3> The adhesive does not shrink during the curing process and has better waterproof, moisture-proof and anti-aging properties.
4> The adhesive has Excellent thermal conductivity and flame retardancy and good electrical insulation properties.
Detailed Photos

 

High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
 
Company Profile

    Keraf group was founded in 2014 under the exclusive and strategic mandate of GrafTech®, a world-renowned graphite brand with a history of more than 130 years, to expand the Chinese market. Our company is located in the complete industrial chain, full competition, with the world factory reputation of Dongguan City, China.
    Keraf tech is a well-established and professionally managed corporation with nearly 10 years of distinguished record in research and development, production, and marketing of various interface materials and components in China domestic and overseas markets.
    After nearly ten years of technology accumulation and intensive development, Keraf group has been transformed from a factory focused on OEM thermal management materials die-cutting production into a comprehensive industrial group with one-stop services such as ODM thermal tech design, hardware and plastic processing, LSR components, industrial coating materials and so on.
    Keraf group's core products have covered 3C electronics, semiconductor, equipment, automotive, new energy, photovoltaic power generation, shipping, aviation and other industries to provide a full range of high performance, excellent quality interface material solutions.
    Always adhering to the integrity, focus, innovation, win-win business philosophies, Keraf Group have already established and maintained a good cooperative relationship with many global clients. We are also looking forward to becoming one of your reliable and trusted long-term strategic partners.

High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply

Certifications

High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power SupplyHigh Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply

Facilities and Equipment

High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply

Our business portfolio

 

High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply

Our Advantages

High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply

Packaging & Shipping

 

High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply

 



 






 

About the Supplier

This supplier has been audited by TÜV Rheinland. Verify the report on the official TÜV Rheinland website with ID "MIC-ASR252850". Items marked "verified" are certified.

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Dongguan Keraf Electronic Technology Co., Ltd.
Dongguan Keraf Electronic Technology Co., Ltd.
Dongguan Keraf Electronic Technology Co., Ltd.
Dongguan Keraf Electronic Technology Co., Ltd.
Dongguan Keraf Electronic Technology Co., Ltd.
Dongguan Keraf Electronic Technology Co., Ltd.
Dongguan Keraf Electronic Technology Co., Ltd.
Dongguan Keraf Electronic Technology Co., Ltd.

About Our Factory & Business Background

verified Business Type
Manufacturer/Factory & Trading Company
Address
Dongguan, Guangdong, China
verified Terms of Payment
T/T
verified International Commercial Terms(Incoterms)
FOB
verified Average Lead Time
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
verified Nearest Port
Shenzhen Port
verified Minimum Order Quantity
1000 pcs
verified Supply Chain Partners
73

Our Production Capability & Technical Expertise

Main Products
Graphite Sheet and Die Cutting Parts Thereof, Die-Cut Components for The Electronics Industry, Auxiliary Materials for The Semiconductor Field, Industrial Materials for Coating or Components, Hardware Plastic Design and Manufacturing, LSR Processing and Assembly Parts Thereof
verified Production Lines
3
verified Production Machines
Liquid silicone rubber molding machine, Horizontal injection press, Vertical injection molding machine, CCD, VMS, Constant temperature and humidity test chamber, Rubber alcohol abrasion testing machine, RCA Paper tape abrasion testing machine, Digital display constant temperature water bath pot, Air tightness tester, Tensiometer
verified QA/QC inspectors
1 people
verified Inspection Type for Finished Products
Random inspection(Visual inspection & Function inspection)
verified Inspection Method for Finished Products
Have instructions and uniformly followed
verified Customization Options
Customization from Samples, Customization from Designs, Full Customization, Minor Customization, Flexible customization
verified ODM Service Available
Yes
verified OEM Service Available
Yes
verified R&D Engineers
4 people
verified Traceability of Raw Materials
No

Our Industry Experience & Global Business Record

verified Year of Establishment
2014-10-20
verified Export Year
11 Years
verified Main Markets
Southeast Asia/ Mideast, Domestic
verified Number of Foreign Trading Staff
5
verified Overseas Agent/Branch
No
verified New Products Launched in Last year
No

FAQ

What is the mixture ratio of the adhesive?
The mixture ratio by weight for Component A and Component B is 1:1.
What is the shelf life of the product?
It is best to use the product within 12 months from the date of delivery.
Is customization available for this adhesive?
Yes, customization is available, including product composition, mixture ratio, thermal conductivity, and material specifications.
What is the hardness of the cured adhesive?
The hardness is typically 55-65 Shore A.
What industries can this adhesive be used for?
It is suitable for automobile, construction, fiber & garment, footwear & leather, woodworking, and power module applications.

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