• High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
  • High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
  • High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
  • High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
  • High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
  • High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply

High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply

Bonding Function: Potting Adhesive
Morphology: Liquid
Application: Automobile, Construction, Woodworking, Footwear & Leather, Fiber & Garment
Material: Silicone
Classification: Room Curing
Characteristic: Waterproof
Samples:
US$ 3/kg 1 kg(Min.Order)
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Customization:
Manufacturer/Factory

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  • Overview
  • Product Parameters
  • Detailed Photos
  • Company Profile
  • Certifications
  • Facilities and Equipment
  • Our business portfolio
  • Our Advantages
  • Packaging & Shipping
Overview

Basic Info.

Promoter Composition
Solvent
Composition
Organic Material
Color
Grey
Product Composition
Component a Glue:Component B Glue
Mixture Ratio, by Weight
a:B=1:1
Thermal Conductivity
1W/M-K
Customization
Available
Transport Package
Carton/Pallet
Specification
customizable
Origin
China

Product Description

Product Parameters
Main items / Subitems Specifications / Values
Product composition Component A glue:Component B glue
Appearance / Color Component A glue Component B glue
Liquid/Gray Liquid/White
Mixture ratio, by weight A:B=1:1
Cured color Gray
Main
Characteristics
Items Unit Test method Typical Value
Hardness Shore A ASTM D2240 55 ~ 65
viscosity CPS ASTM D412 3500~4500
Operation time (25ºC) Min N/A 30~60 min
Volume resistivity Ω • cm ASTM D419 >=1.0*1016
Curing speed(25ºC) Hour N/A 4~8H
Density g/cm3 ASTM D792 1.5~1.6
Dielectric strength kV / mm ASTM D3755 >=20
Dielectric constant 1.2MHz ASTM D150 2.8~3.3
Dilatation coefficient m/ (m·K) ASTM D696 <=2.1*104
Thermal Conductivity W/m·K ASTM D5470 1
Storage Condition Stored in original cartons at 70°F (21°C) and 50% relative humidity
Period Of Validity It is best to use it within 12 months from date of delivery
Product Main Features:
1> Two-component silicone additive potting adhesive, universal, low viscosity, easy to operate.
2> The adhesive material is stored for a long time after mixing at room temperature, but it can be quickly cured under heating conditions.
3> The adhesive does not shrink during the curing process and has better waterproof, moisture-proof and anti-aging properties.
4> The adhesive has Excellent thermal conductivity and flame retardancy and good electrical insulation properties.
Detailed Photos

 

High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
 
Company Profile

    Keraf group was founded in 2014 under the exclusive and strategic mandate of GrafTech®, a world-renowned graphite brand with a history of more than 130 years, to expand the Chinese market. Our company is located in the complete industrial chain, full competition, with the world factory reputation of Dongguan City, China.
    Keraf tech is a well-established and professionally managed corporation with nearly 10 years of distinguished record in research and development, production, and marketing of various interface materials and components in China domestic and overseas markets.
    After nearly ten years of technology accumulation and intensive development, Keraf group has been transformed from a factory focused on OEM thermal management materials die-cutting production into a comprehensive industrial group with one-stop services such as ODM thermal tech design, hardware and plastic processing, LSR components, industrial coating materials and so on.
    Keraf group's core products have covered 3C electronics, semiconductor, equipment, automotive, new energy, photovoltaic power generation, shipping, aviation and other industries to provide a full range of high performance, excellent quality interface material solutions.
    Always adhering to the integrity, focus, innovation, win-win business philosophies, Keraf Group have already established and maintained a good cooperative relationship with many global clients. We are also looking forward to becoming one of your reliable and trusted long-term strategic partners.

High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply

Certifications

High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power SupplyHigh Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply

Facilities and Equipment

High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply

Our business portfolio

 

High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply

Our Advantages

High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply

Packaging & Shipping

 

High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply
High Thermal Conductivity Excellent Dielectric Properties Ab Liquid Silicone Potting Adhesive for Power Module Integrated Chip LED Driver Power Supply

 



 






 

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