• Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
  • Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
  • Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
  • Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
  • Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
  • Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing

Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing

Certification: GS, RoHS, CE, ISO9001
Color: Transparent
Heat Resistance: Normal Temperature
Waterproof: Waterproof
Application: Wafer Dicing
Adhesive: Acrylic
Samples:
US$ 6/Square Meter 1 Square Meter(Min.Order)
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Customization:
Manufacturer/Factory

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  • Overview
  • Product Parameters
  • Detailed Photos
  • Company Profile
  • Certifications
  • Facilities and Equipment
  • Our business portfolio
  • Our Advantages
  • Packaging & Shipping
Overview

Basic Info.

Model NO.
MG-6410B-AU
Base Material
Po Film
Type
Wafer UV Dicing Tape
Product Name
UV Release Dicing Tape
Liner
Pet Release Liner
Feature
Easy Peeling No Residue
Adhesion Before UV
280~380 G/in
Adhesion After UV Irradiation
< 10 G/in
Customization
Available
Transport Package
Carton
Specification
customizable
Trademark
Migui
Origin
Dongguan

Product Description

Product Parameters

Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing

Main items / Subitems Specifications / Values
Carrier type or Base Backing 80 μm polyolefin carrier
Type of release film With clear PET self-liner
Appearance / Color Roll / Matte translucent
Single roll finished product
available dimensional value
Total available thickness(μm) 90 ± 5
Roll Width(mm) [customizable] 400
Roll Length(M)  [customizable] 100
Main
Characteristics
Items Unit Typical value Test method
Adhesion before UV irradiation g/in 280~380 JIS Z0237
Adhesion after UV irradiation g/in < 10 JIS Z0237
UV radiation mJ/cm2 300 UV energy meter
Tensile Strength(MD) N/cm 23 JIS K6768
Tensile Strength(TD) N/cm 19 JIS K6768
Elongation(MD) % 660 JIS K6732
Elongation(TD) % 690 JIS K6732
Storage Condition  stored in original cartons at 70°F (21°C) and 50% relative humidity
Period Of Validity 6 months from date of manufacture, avoid exposing to direct sunlight
Detailed Photos
Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
Company Profile

    Keraf group was founded in 2014 under the exclusive and strategic mandate of GrafTech®, a world-renowned graphite brand with a history of more than 130 years, to expand the Chinese market. Our company is located in the complete industrial chain, full competition, with the world factory reputation of Dongguan City, China.
    Keraf tech is a well-established and professionally managed corporation with nearly 10 years of distinguished record in research and development, production, and marketing of various interface materials and components in China domestic and overseas markets.
    After nearly ten years of technology accumulation and intensive development, Keraf group has been transformed from a factory focused on OEM thermal management materials die-cutting production into a comprehensive industrial group with one-stop services such as ODM thermal tech design, hardware and plastic processing, LSR components, industrial coating materials and so on.
    Keraf group's core products have covered 3C electronics, semiconductor, equipment, automotive, new energy, photovoltaic power generation, shipping, aviation and other industries to provide a full range of high performance, excellent quality interface material solutions.
    Always adhering to the integrity, focus, innovation, win-win business philosophies, Keraf Group have already established and maintained a good cooperative relationship with many global clients. We are also looking forward to becoming one of your reliable and trusted long-term strategic partners.

Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing

Certifications

Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor PolishingWafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing

Facilities and Equipment

Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing

Our business portfolio

 

Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing

Our Advantages

Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing

Packaging & Shipping

 

Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing


 

 

 

 

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